PCB Assembly Capabilities — What We Can Build for You
Below is a clear, specific overview of our PCB assembly capabilities at Bharat Tech EMS. We believe buyers deserve to know exactly what a manufacturer can handle before they reach out. If your requirement fits what you see here — we'd love to talk.
Assembly Technology Capabilities
| Capability | Specification |
|---|---|
| Assembly Technologies | SMT | THT (Through-Hole) | Mixed Technology | Box Build |
| Minimum Component Size | 0201 (0.6mm × 0.3mm) passives | 01005 (0.4mm × 0.2mm) on request |
| IC Packages Handled | BGA (all pitches) | QFN | LGA | CSP | QFP | SOIC | DIP | SOP | PLCC |
| PCB Layer Count | Single layer (1L) to 24-layer multilayer PCBs |
| PCB Board Size | Min: 10mm × 10mm | Max: 500mm × 500mm |
| PCB Types Supported | Rigid FR-4 | Rigid HDI | Flex | Rigid-Flex | Aluminium (MCPCB) |
| Solder Process | Lead-free (RoHS) | Standard leaded | Both available |
| Soldering Methods | Reflow | Wave | Selective | Hand soldering (IPC J-STD-001) |
| Nitrogen Reflow | Available for oxygen-sensitive applications |
| Minimum Order Quantity | 1,000 pieces per production run |
| Production Volume | 1,000 to 500,000+ boards per run |
| Lead Time | 15–25 working days (rush available) |
| Quality Inspection | SPI | AOI | X-Ray | ICT | Functional Test | IPC A-610 Visual |
| Quality Standards | ISO 9001:2015 | IPC-A-610 Class 2 & 3 | IPC J-STD-001 | RoHS |
| Conformal Coating | Acrylic | Silicone | Urethane | Selective or full board |
| Programming | MCU | FPGA | Flash | EEPROM (in-circuit & gang) |
| Component Traceability | Full lot-level traceability — reel to finished board |
| Panelisation | V-score | Tab route | Custom panel designs |
| Markets Served | India | USA | EU | UAE | Southeast Asia |
Our Step-by-Step Production Process
Every PCB assembly order at Bharat Tech EMS follows the same disciplined, documented production process. No shortcuts. No skipped inspection steps.
| Step | Process Stage | What Happens |
|---|---|---|
| 1 | Engineering Review & DFM | Your Gerber, BOM, and specs reviewed for manufacturability. Issues flagged before production. |
| 2 | Quotation | Detailed quote with unit price, tooling, lead time, and shipping — within 24–48 hours. |
| 3 | Order Confirmation & Component Procurement | Components sourced from authorised distributors. Authenticity and date codes verified. |
| 4 | Incoming Inspection | Components inspected on receipt. Moisture-sensitive devices stored in controlled humidity. |
| 5 | Stencil & Setup | SMT stencil prepared. Pick-and-place programs loaded and verified. |
| 6 | Solder Paste Printing & SPI | Solder paste applied. SPI run to verify volume and alignment. |
| 7 | SMT Pick & Place | Components placed using automated machines. Full reel traceability maintained. |
| 8 | Reflow Soldering | Boards reflowed under controlled thermal profile as per requirement. |
| 9 | AOI Inspection | 100% automated optical inspection. Defects identified and corrected. |
| 10 | Through-Hole Assembly | THT insertion and wave/selective soldering performed if required. |
| 11 | X-Ray Inspection | BGA joints inspected via X-ray. Voids or bridges corrected. |
| 12 | ICT & Functional Testing | Electrical and functional tests conducted. Results logged per board. |
| 13 | Conformal Coating | Coating applied, cured, and inspected for uniform coverage. |
| 14 | Programming | Firmware flashed and verified. |
| 15 | Final Inspection & Packing | IPC A-610 inspection completed. Packed with full documentation. |
| 16 | Delivery | Shipped via courier, freight, or international carriers with export documentation. |
