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Home/Capabilities

PCB Assembly Capabilities &
Technical Specifications

Every specification you need to know before reaching out. If your board fits these specs, we can build it at volume.

10×10 – 500×500 mm
Board Size Range
1 Layer – 24 Layer
PCB Layer Count
SMT · THT · Mixed · Box Build
Assembly Technologies
0201 Standard · 01005 Available
Min Component Size
BGA All Pitches incl. 0.4mm
IC Package Support
1,000 – 500,000+ Boards
Production Volume
Full Specification Sheet

Complete Manufacturing Specifications

Everything you need to confirm technical fit before sending your RFQ. All specifications are production-confirmed — not marketing targets.

Capability / Parameter Rionyx Industries Specification
Assembly Technologies SMTThrough-Hole (THT)Mixed TechnologyBox Build & System IntegrationConsigned Assembly
Minimum Component Size 0201 (0.6×0.3mm) as standard  ·  01005 (0.4×0.2mm) on request
IC Package Types Supported BGA all pitches (0.4mm–1.27mm)QFNLGACSPDFNQFP (0.4mm pitch)SOICSSOPDIPPLCC
PCB Layer Count 1-Layer (single-sided) through 24-Layer multilayer PCBs
Board Size — Minimum 10mm × 10mm
Board Size — Maximum 500mm × 500mm  (custom panel sizes available on request)
PCB Base Material FR-4 (standard)  ·  High-Tg FR-4  ·  Rogers / PTFE (RF boards)  ·  Aluminium MCPCB  ·  Polyimide (Flex)
PCB Types Rigid FR-4HDIFlex PCBRigid-FlexMCPCB (Aluminium)Rogers RF
Copper Thickness 0.5 oz to 6 oz per layer  ·  Standard: 1 oz
Min Trace / Space 75µm / 75µm standard  ·  50µm / 50µm for HDI
Min Hole Size 0.2mm (laser drill)  ·  0.3mm (mechanical drill)
Solder Paste SAC305 lead-free (standard)  ·  Sn63/Pb37 leaded (available on request)
Soldering Methods Reflow (hot air / N₂)  ·  Wave solder  ·  Selective solder  ·  Hand solder (J-STD-001)
Surface Finish HASL  ·  ENIG  ·  ENEPIG  ·  OSP  ·  Immersion Tin  ·  Immersion Silver
Lead Time — Standard 15–25 working days from order confirmation
Lead Time — Express 10–15 working days (surcharge applies — confirm availability)
Lead Time — Rush 5–10 working days (confirm slot availability before ordering)
Minimum Order Quantity 1,000 boards per production run
Maximum Batch Size 500,000+ boards per run (schedule confirmation required)
SPI — Solder Paste Inspection 100% inspection after paste printing — volume, area, height, alignment
AOI — Automated Optical 100% AOI after SMT placement and after reflow — two separate passes
X-Ray Inspection BGA, QFN, LGA hidden-joint inspection — 100% or sampling basis
ICT — In-Circuit Test Per your fixture and test specification — full electrical verification
Functional Test Board-level powered functional test per your procedure
IPC-A-610 Visual Class 2 and Class 3 visual inspection — certified inspectors
Conformal Coating Acrylic (AR)  ·  Silicone (SR)  ·  Urethane (UR) — selective spray or full-board
In-Circuit Programming MCU · FPGA · Flash · EEPROM — JTAG, SWD, ISP  ·  in-circuit and gang fixtures
Quality Standards ISO 9001:2015  ·  IPC-A-610 Class 2 & 3  ·  J-STD-001  ·  RoHS 2.0  ·  REACH
Component Sourcing Authorised distributors only — Digi-Key, Mouser, Arrow, Avnet, Indian authorised channels
Traceability Full lot-level — component reel to finished board — searchable records
Export Documentation Certificate of Origin  ·  Packing list  ·  Invoice  ·  RoHS/REACH declaration  ·  AWB/BL
Markets Served Pan-India domestic  ·  Export: USA, UK, Germany, UAE, Singapore & more
File Requirements

What We Need From You — For RFQ and Production

📋 For a Quote (RFQ)
✔Gerber files (RS-274X preferred) — all copper layers, solder mask, silkscreen, drill file
✔Bill of Materials (BOM) in Excel or CSV — with manufacturer part numbers
✔Board quantity per order and expected frequency
✔Any special requirements — IPC class, coating, programming, packaging
🏭 For Production (after quote approval)
✔Finalised Gerber files (same set as RFQ if unchanged)
✔Final approved BOM with approved substitutions noted
✔Centroid / XY pick-and-place data file
✔Functional test specification (if applicable)
✔Firmware files if in-circuit programming is required
By Industry

Industry-Specific Capability Requirements

🚗
Automotive & EV
IPC-A-610 Class 3 · Full lot traceability · X-Ray 100% BGA · PPAP support · AEC-Q component qualification awareness · Wide temp testing
🏭
Industrial Automation
IPC Class 2 minimum · Conformal coating standard · Wide temp range components · ICT coverage · Selective solder for THT connectors
🏥
Medical Devices
IPC-A-610 Class 3 · Strict change control · Full traceability · Cleanliness testing available · No component substitutions without written approval
📡
Telecom & 5G
HDI and fine-pitch BGA · Rogers RF board assembly · EMI shielding support · High pin-count BGA X-Ray · 100GbE NIC assembly capability
☀️
Solar & Energy
MCPCB (aluminium) assembly · High-current THT wave solder · Conformal coating for outdoor exposure · ICT for power electronics
📺
Consumer Electronics
High-volume SMT optimised · IPC Class 2 · Cost-optimised BOM management · AOI and ICT coverage · Fast turnaround for seasonal demand

Ready to Start? Send Us Your Gerbers and BOM.

We respond with a detailed, itemised PCB assembly quote within 24 hours. No obligation. Just a competitive price and an honest lead time from India's trusted PCB assembly partner.

📋 Send Full RFQ ✉️ Email Directly

sales@rionyx.com  ·  +91 93273 29069  ·  +91 79905 88795
Vatva GIDC, Ahmedabad, Gujarat, India  ·  Mon–Sat: 09:00 AM – 06:00 PM IST